wafer
´Ù¸¥ °÷¿¡¼ ã±â
³×À̹ö»çÀü ´ÙÀ½»çÀü Cambridge M-W M-W Thesaurus OneLook Wordnet Google
icecream cone ¾ÆÀ̽ºÅ©¸²À» ´ã´Â ¿ø»Ô²Ã ¿þÀÌÆÛ(wafer)
wafer-thin £Û£÷¢¥£å£é£æ¡Ó£ò¥è£à£é£î£Ý ¾ÆÁÖ ¾ãÀº
wafer £Û£÷¢¥£å£é£æ¡Ó£ò£Ý ¿þÀÌÆÛ, ¿Àºí¶óÅä, (¹Ì»ç¿ëÀÇ)Á¦º´(¾ãÀº »§), ºÀÇÔÁö
¿þÀÌÆÛ (Wafer)
Comdex Korea Kicks Off Next Week
Äĵ¦½ºÄÚ¸®¾Æ ³»ÁÖºÎÅÍ ¿·Á
Comdex Korea, one of the largest computer information and communication
events in the world, will kick off at the Convention and
Exposition Center on Aug. 24 and run through the 27th.
¼¼°èÃÖ´ëÀÇ ÄÄÇ»ÅÍÁ¤º¸Åë½ÅÀü½Ãȸ Áß ÇϳªÀÎ Äĵ¦½ºÄÚ¸®¾Æ°¡ COEX¿¡¼
8¿ù 24ÀÏ °³ÃֵǾî 27ÀϱîÁö ¿¸± ¿¹Á¤ÀÌ´Ù.
A total of 110 local and foreign companies will exhibit a dazzling array of
products and services including internet virtual trading systems,
internet services, and superior speed digital home appliances.
110°³ÀÇ ±¹³»¿Ü¾÷üµéÀÌ Âü°¡ÇÏ¿© ÀÎÅͳݰ¡»ó°Å·¡½Ã½ºÅÛ, ÀÎÅͳÝÁ¢¼Ó¼ºñ½º,
Ãʰí¼ÓµðÁöÅа¡ÀüÁ¦Ç° µîÀÇ È·ÁÇÑ Á¦Ç°°ú ¼ºñ½º¸¦ Àü½ÃÇÒ ¿¹Á¤ÀÌ´Ù.
Included in this high-tech extravaganza will be MP3 players that play
up to 20 digital music files, wall mounted, wafer thin TV sets,
and seminars and technical conferences on LINUX, the world's first free
operating system.
ÀÌ ÇÏÀÌÅ×Å© ÃàÁ¦¿¡´Â 20°³ÀÇ À½¾ÇÈÀϱîÁö Àç»ýÇÒ ¼ö ÀÖ´Â MP3 Ç÷¹À̾î,
ÃʹÚÇü º®°ÉÀÌTVµµ ¼±º¸ÀÌ°í ¼¼°èÃÖÃÊÀÇ ¹«·á ¿î¿µÃ¼Á¦ ¸®´ª½º °ü·Ã ¼¼¹Ì³ª¿Í
ÄÁÆÛ·±½ºµµ ¿¸± ¿¹Á¤ÀÌ´Ù.
[À§Å°] ¿þÀÌÆÛ Wafer (electronics)
[À§Å°] ¿þÇϽº Wafer
[ÛÝ] ¿þÀÌÆÛ wafer
wafer ¿þÀÌÆÛ½º
wafer-thin ¸Å¿ì¾ãÀº,±Ù¼ÒÇÑÂ÷ÀÌÀÇ
Si wafer ½Ç¸®ÄÜ ¿þÀÌÆÛ
wafer ¿þÀÌÆÛ[¹ÝµµÃ¼µîÀÇ],¹ÚÆÇ
wafer : ¿þÀÌÆÛ
HS1905
Bread, pastry, cakes, biscuits and other bakers' wares, whether or not containing cocoa; communion wafers, empty cachets of a kind suitable for pharmaceutical use, sealing wafers, rice paper and similar products.
»§¤ýÆÄÀ̤ýÄÉÀÌÅ©¤ýºñ½ºÅ¶°ú ±× ¹ÛÀÇ º£ÀÌÄ¿¸® Á¦Ç°(ÄÚÄھƸ¦ ÇÔÀ¯ÇÏ¿´´ÂÁö¿¡ »ó°ü¾ø´Ù), ¼ºÂù¿ë ¿þÀÌÆÛ¤ýÁ¦¾à¿ë¿¡ ÀûÇÕÇÑ ºó ĸ½¶¤ý½Ç¸µ¿þÀÌÆÛ(sealing wafer)¤ý¶óÀ̽ºÆäÀÌÆÛ(rice paper)¿Í ±× ¹Û¿¡ ÀÌ¿Í À¯»çÇÑ ¹°Ç°
HS19053
Sweet biscuits; waffles and wafers :
½ºÀ§Æ® ºñ½ºÅ¶, ¿ÍÇÃ, ¿þÀÌÆÛ
HS1905320000
Waffles and wafers
¿ÍÇðú ¿þÀÌÆÛ
HS381800
Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics.
ÀüÀÚ°ø¾÷¿¡ »ç¿ëÇϱâ À§ÇÏ¿© µµÇÁ󸮵È(doped) ÈÇпø¼Ò(µð½ºÅ©¤ý¿þÀÌÆÛ ¸ð¾çÀ̳ª ÀÌ¿Í À¯»çÇÑ ¸ð¾çÀ¸·Î ÇÑÁ¤ÇÑ´Ù), ÀüÀÚ°ø¾÷¿¡ »ç¿ëÇϱâ À§ÇÏ¿© µµÇÁ󸮵È(doped) ÈÇÐÈÇÕ¹°
HS4410
Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances.
ÆÄƼŬº¸µå(particle board), ¹èÇ⼺(ÛÕú¾àõ)ÀÌ ÀÖ´Â ½ºÆ®·£µå º¸µå(OSB: oriented strand board)¿Í ÀÌ¿Í À¯»çÇÑ º¸µå[¿¹: ¿þÀÌÆÛº¸µå(wafer board)](¸ñÀ糪 ±× ¹ÛÀÇ ¸ñÁúÀç·á·Î ¸¸µç °ÍÀ¸·Î ÇÑÁ¤Çϸç, ¼öÁö³ª ±× ¹ÛÀÇ À¯±â°áÇÕÁ¦·Î ÀÀ°á½ÃŲ °ÍÀÎÁö¿¡ »ó°ü¾ø´Ù)
HS6903102010
For furnaces for production of semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ(wafer) Á¦Á¶¿¡ »ç¿ëµÇ´Â ³ë(ÒÄ)¿ë
HS7020001011
Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ(wafer) Á¦Á¶¿ëÀ¸·Î È®»ê·Î(üªß¤ÖÓ)¿Í »êÈ·Î(ß«ûùÖÓ)¿¡ »ðÀÔÇÒ ¼ö ÀÖµµ·Ï °í¾ÈµÈ ¼®¿µ ¸®¾×ÅÍ(reactor) Æ©ºê¿Í Ȧ´õ
HS7020001012
Quartz crucibles for furnace of production of semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ(wafer) Á¦Á¶¿¡ »ç¿ëµÇ´Â ³ë(ÒÄ)¿ë ¼®¿µ µµ°¡´Ï
HS7319402000
Pin used for measuring or checking semiconductor wafers or device
¹ÝµµÃ¼ ¿þÀÌÆÛ¤ý¹ÝµµÃ¼ µð¹ÙÀ̽ºÀÇ ÃøÁ¤À̳ª °Ë»ç¿¡ »ç¿ëµÇ´Â ÇÉ
HS8202392010
For machines sawing semiconductor wafer or device into each unit
¹ÝµµÃ¼ ¿þÀÌÆÛ, ¹ÝµµÃ¼ µð¹ÙÀ̽º¸¦ °³º° ´ÜÀ§·Î Àý´ÜÇÏ´Â ±â±â¿¡ »ç¿ëµÇ´Â °Í
HS8486
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in Note 9 (C) to this Chapter; parts and accessories.
¹ÝµµÃ¼ º¸¿ï(boule)À̳ª ¿þÀÌÆÛ(wafer)¤ý¹ÝµµÃ¼µð¹ÙÀ̽º¤ýÀüÀÚÁýÀûȸ·Î¤ýÆòÆÇµð½ºÇ÷¹ÀÌÀÇ Á¦Á¶¿¡ Àü¿ëµÇ°Å³ª ÁÖ·Î »ç¿ëµÇ´Â ±â°è¿Í ±â±â, ÀÌ ·ùÀÇ ÁÖ Á¦9È£´Ù¸ñ¿¡¼ ƯÁ¤ÇÑ ±â°è¿Í ±â±â, ±× ºÎºÐǰ°ú ºÎ¼Óǰ
HS848610
Machines and apparatus for the manufacture of boules or wafers
º¸¿ï(boule)À̳ª ¿þÀÌÆÛ(wafer) Á¦Á¶¿ë ±â°è¿Í ±â±â
HS84861030
Machine-tools for working boules or wafers
º¸¿ï(boule)À̳ª ¿þÀÌÆÛ(wafer)ÀÇ °¡°ø¿ë °øÀÛ±â°è
HS8486103020
Grinding or polishing machines for processing of wafer, including lapping machines
¿þÀÌÆÛ °¡°ø¿ëÀÇ ¿¬¸¶±â¤ý±¤Åñâ(·¡Çα⸦ Æ÷ÇÔÇÑ´Ù)
HS8486104011
Machines for working any material by removal of material in the production of semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶°øÁ¤¿¡¼ Àç·á¸¦ Á¦°ÅÇÏ´Â ¹æ½Ä¿¡ ÀÇÇÏ¿© Àç·á¸¦ °¡°øÇÏ´Â ±â°è
HS8486104021
Apparatus for stripping or cleaning wafers
¿þÀÌÆÛ¸¦ ½ºÆ®¸®ÇΤý¼¼Ã´ÇÏ´Â ±â±â
HS8486202210
For the manufacture of semiconductor devices on semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ À§¿¡ ¹ÝµµÃ¼ ¼ÒÀÚ¸¦ Á¦Á¶ÇÏ´Â ¿ëµµÀÇ °Í
HS8486202310
Apparatus for rapid heating of semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ ±Þ¼Ó°¡¿±â
HS8486204000
Machines for depositing membrance or sputtering metal on semiconductor wafers
¹ÝµµÃ¼¿þÀÌÆÛ À§¿¡ ¸·À» Çü¼ºÇϰųª ±Ý¼ÓÀ» ÁõÂøÇÏ´Â ±â°è
HS8486206010
Direct write-on-semiconductor wafer apparatus
¹ÝµµÃ¼¿þÀÌÆÛ À§¿¡ Á÷Á¢ ±×¸®´Â ±â±â
HS8486207000
Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ¸¦ ½À½Ä ½Ä°¢, Çö»ó, ½ºÆ®¸®ÇÎÇϰųª ¼¼Ã´ÇÏ´Â ±â°è
HS8486208120
Machines for working any material by removal of material in the production of semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛ Á¦Á¶°øÁ¤¿¡¼ Àç·á¸¦ Á¦°ÅÇÏ´Â ¹æ½Ä¿¡ ÀÇÇÏ¿© Àç·á¸¦ °¡°øÇÏ´Â ±â°è
HS8486208420
Apparatus for stripping or cleaning semiconductor wafers
¹ÝµµÃ¼¿þÀÌÆÛ¸¦ ½ºÆ®¸®ÇÎÇϰųª ¼¼Ã´ÇÏ´Â ±â±â
HS8486209110
Spraying appliances for etching, stripping or cleaning semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛÀÇ ½Ä°¢, ½ºÆ®¸®ÇÎÇϰųª ¼¼Ã´À» À§ÇÑ ºÐ»ç±â
HS8486209310
Grinding or polishing machines for processing of semiconductor wafer, including lapping machines
¹ÝµµÃ¼ ¿þÀÌÆÛ°¡°ø¿ëÀÇ ¿¬¸¶±â¤ý±¤Åñâ(·¡Çα⸦ Æ÷ÇÔÇÑ´Ù)
HS848620932
Dicing machines for scribing or scoring semiconductor wafers
¹ÝµµÃ¼ ¿þÀÌÆÛÀÇ ½ºÅ©¶óÀ̺ù¤ý½ºÄھÀ» À§ÇÑ ´ÙÀ̱̽â
HS8486209400
Machine for washing wafers, carrier or tube
¿þÀÌÆÛ¤ýij¸®¾î¤ýÆ©ºê¸¦ ¼¼Ã´ÇÏ´Â ±â°è
HS8486209500
Machine for mounting tape on semiconductor wafers
¹ÝµµÃ¼¿þÀÌÆÛ À§¿¡ Å×ÀÌÇÁ¸¦ ºÎÂø½ÃŰ´Â ±â°è
HS8486209600
Machine for sawing semiconductor wafer into chips
¹ÝµµÃ¼¿þÀÌÆÛ¸¦ °³º° ĨÀ¸·Î Àý´ÜÇÏ´Â ±â±â
HS8486402050
Apparatus designed to bond or detach wafer on ceramic block
¿þÀÌÆÛ¸¦ ¼¼¶ó¹ÍÆÇ¿¡ ºÎÂø¤ýºÐ¸®ÇÏ´Â ±â°è
HS8486402080
Machines for bonding semiconductor die, washing wafers, carrier or tube
¹ÝµµÃ¼ ´ÙÀ̸¦ ºÎÂøÇϰųª ¿þÀÌÆÛ, ij¸®¾î, Æ©ºê¸¦ ¼¼Ã´ÇÏ´Â ±â°è
HS8486402093
Machines for forming connections(bump) on an entire wafer before dicing
¿þÀÌÆÛÀÇ Àý´Ü ÀÌÀü¿¡ Àüü ¿þÀÌÆÛ¿¡ ¿¬°áÁ¢Á¡(¹üÇÁ)À» Çü¼ºÇÏ´Â ¿þÀÌÆÛ ¹üÇÎ¿ë ±â±â
HS84864030
Machines and apparatus for lifting, handing, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays
º¸¿ï, ¿þÀÌÆÛ, ¹ÝµµÃ¼ µð¹ÙÀ̽º, ÀüÀÚÁýÀûȸ·Î¿Í ÆòÆÇµð½ºÇ÷¹ÀÌÀÇ ±Ç¾ç¿ë, ÇÏ¿ª¿ë, ÀûÇÏ¿ë, ¾çÇÏ¿ë ±â°è¿Í ±â±â
HS8486403010
Automated machines and apparatus for transport, handling and storage of semiconductor wafers, wafer cassettes, boxes and other material for semiconductor devices
¹ÝµµÃ¼ ¼ÒÀÚ Á¦Á¶¿ë ¿þÀÌÆÛ, ¿þÀÌÆÛÄ«¼ÂÆ®, »óÀÚ³ª ±× ¹ÛÀÇ ¹°Ç°À» À̼Û, Çڵ鸵 ±×¸®°í ÀúÀåÇϱâ À§ÇÑ °Í
HS84869010
Of machines and apparatus for the manufacture of boules or wafers
º¸¿ï¤ý¿þÀÌÆÛ Á¦Á¶¿ë ±â°è¿Í ±â±âÀÇ °Í
HS8541101000
Chips, dice and wafers not yet cut into chips
Ĩ, ´ÙÀ̽º¿Í Àý´ÜµÇÁö ¾ÊÀº ¿þÀÌÆÛ
HS8541211000
Chips, dice and wafers not yet cut into chips
Ĩ, ´ÙÀ̽º¿Í Àý´ÜµÇÁö ¾ÊÀº ¿þÀÌÆÛ
HS8541291000
Chips, dice and wafers not yet cut into chips
Ĩ, ´ÙÀ̽º¿Í Àý´ÜµÇÁö ¾ÊÀº ¿þÀÌÆÛ
HS8541301000
Chips, dice and wafers not yet cut into chips
Ĩ, ´ÙÀ̽º¿Í Àý´ÜµÇÁö ¾ÊÀº ¿þÀÌÆÛ
HS8541401000
Chips, dice and wafers not yet cut into chips
Ĩ, ´ÙÀ̽º¿Í Àý´ÜµÇÁö ¾ÊÀº ¿þÀÌÆÛ
HS8541501000
Chips, dice and wafers not yet cut into chips
Ĩ, ´ÙÀ̽º¿Í Àý´ÜµÇÁö ¾ÊÀº ¿þÀÌÆÛ
HS9011101000
Fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles
¹ÝµµÃ¼ ¿þÀÌÆÛ³ª ·¹Æ¼Å¬ÀÇ Ãë±Þ°ú À̼ۿëÀ¸·Î Ưº°È÷ °í¾ÈµÈ ÀåÄ¡°¡ ºÎÂøµÈ °Í
HS9011201010
Fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles
¹ÝµµÃ¼ ¿þÀÌÆÛ³ª ·¹Æ¼Å¬ÀÇ Ãë±Þ°ú À̼ۿëÀ¸·Î Ưº°È÷ °í¾ÈµÈ ÀåÄ¡°¡ ºÎÂøµÈ °Í
HS9012101010
Electron beam microscopes, fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles
ÀÏ·ºÆ®·Ð ºö Çö¹Ì°æ(¹ÝµµÃ¼ ¿þÀÌÆÛ³ª ·¹Æ¼Å¬ÀÇ Ãë±Þ°ú À̼ۿëÀ¸·Î Ưº°È÷ °í¾ÈµÈ ÀåÄ¡°¡ ºÎÂøµÈ °ÍÀ¸·Î ÇÑÁ¤ÇÑ´Ù)
HS9030820000
For measuring or checking semiconductor wafers or devices
¹ÝµµÃ¼ ¿þÀÌÆÛ³ª ¼ÒÀÚÀÇ ÃøÁ¤¿ëÀ̳ª °Ë»ç¿ë
HS903141
For inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices
¹ÝµµÃ¼ ¿þÀÌÆÛ¿Í ¼ÒÀÚ °Ë»ç¿ëÀ̳ª ¹ÝµµÃ¼ ¼ÒÀÚ Á¦Á¶¿¡ »ç¿ëµÇ´Â Æ÷Å丶½ºÅ©(photomask)³ª ·¹Æ¼Å¬(reticle) °Ë»ç¿ë
HS9031412000
For measuring surface particulate contamination on semiconductor wafers
¹ÝµµÃ¼¿þÀÌÆÛ Ç¥¸éÀÇ ÆÄƼŬ ¿À¿°»óÅÂ ÃøÁ¤¿ë
HS90319010
For the purpose of semiconductor manufacturing (including inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices)
¹ÝµµÃ¼ Á¦Á¶¿ë[¹ÝµµÃ¼ ¿þÀÌÆÛ¿Í ¼ÒÀÚ °Ë»ç¿ëÀ̳ª ¹ÝµµÃ¼ ¼ÒÀÚ Á¦Á¶¿¡ »ç¿ëµÇ´Â Æ÷Å丶½ºÅ©(photomask)³ª ·¹Æ¼Å¬(reticle) °Ë»ç¿ëÀÇ °ÍÀ» Æ÷ÇÔÇÑ´Ù]
ÀüÀÚºÎǰ, ¿øÀÚÀç ¹× ¾×¼¼¼¸® Electronic component parts and raw materials and accessories
¹æ¿ÆÇ Heat sinks
¹ÝµµÃ¼´ÙÀ̽º Semiconductor dies
¹ÝµµÃ¼¿þÀÌÆÛ Semiconductor wafers
ÁýÀûȸ·ÎÆÐŰÁö Integrated circuit packages
ÁýÀûȸ·Î¿ë¼ÒÄ϶Ǵ¸¶¿îÆ® Integrated circuit sockets or mounts
ÀÌ»ê¼ÒÀڿ븶¿îÆ® Discrete component mounts
¹æ¿ÆÇÄÞÆÄ¿îµå Heat sink compounds
¹æ¿ÆÇ¿ëÀý¿¬Ã¼ Insulators for heat sinks
¿þÀÌÆÛÆÐÅϹöÅÍÇöóÀ̹ëºê Butterfly wafer pattern valves
´ÙÀ̾îÇÁ·¥¹ëºê Diaphragm valves
ÀζóÀÎüũ¹ëºê Inline check valves
³ªÀÌÇÁ°ÔÀÌÆ®¹ëºê Knife gate valves
À±È°Ç÷¯±×¹ëºê Lubricated plug valves
¸Óµå¹×½½·¯½¬¹ëºê Mud or slush valves
ºñÀ±È°Ç÷¯±×¹ëºê Nonlubricated plug valves
¿À¸®Çǽº¹ëºê Orifice valves
ÆÄÀÏ·µ¹ëºê Pilot valves
ÇÉÄ¡¹ëºê Pinch valves
ÇǽºÅæÃ¼Å©¹ëºê Piston check valves
ÆßÇÁ¹ëºê Pump valves
¼¾Æ¼³Î¹ëºê Sentinel valves
½½¶óÀÌ´õ¹ëºê Slider valves
½ºÀ®Ã¼Å©¹ëºê Swing check valves
Åͺó¹ëºê Turbine valves
¹ëºêŰƮ Valve kits
¿þÀÌÆÛüũ¹ëºê Wafer check valves
Åä±Û¹ëºê Toggle valves
º¯±â¿ë ÇÊ ¹ëºê Toilet fill valve
¿À½ºÅä¹Ì ¿ëǰ ¹× ºñ¿Ü°úÀû ȯºÎ ¹è¾×¿ëǰ Ostomy supplies and non surgical wound drainage products
¿À½ºÅä¹Ì ±â±â Á¢ÂøÁ¦ Ostomy appliance adhesives
¿À½ºÅä¹Ì ±â±â Ostomy appliances
¿À½ºÅä¹Ì¿ë ¼¼Ã´Á¦ ¶Ç´Â ¹æÃëÁ¦ Ostomy cleaners or deodorants
¿À½ºÅä¹Ì¿ë ÀúÀå¿ëǰ Ostomy collection supplies
¿À½ºÅä¹Ì¿ë ÇǺΠº¸È£Á¦ ¶Ç´Â º¸È£Ä¡·áÁ¦ ŰƮ Ostomy skin barriers or protective care kits
¿À½ºÅä¹Ì¿ë »ðÀÔ±â Ostomy inserts
¿À½ºÅä¹Ì¿ë ¿þÀÌÆÛ Ostomy wafers
ȯºÎ ¹è¾× ÆÄ¿ìÄ¡ Wound drainage pouches
¿À½ºÅä¹Ì ¹é ¸µ Ostomy bag rings
The company's plans depend on the increased manufacturing capabilities of
its newest semiconductor fabrication plant, DMOS-6. The facility will
begin production of the latest 300 millimeter wafer technology by the
second half of 2001, it said.
ÇÏÁö¸¸ ÀÌ °èȹÀº DMOS-6À̶ó°í À̸§ºÙ¿©Áø ÀÌ È¸»çÀÇ »õ·Î¿î »ý»ê°øÀå¿¡ ±×
¼ºÆÐ°¡ ´Þ·ÁÀÖ´Ù°í ÇØµµ °ú¾ðÀº ¾Æ´Ï´Ù. ÀÌ È¸»ç´Â ³»³â ÇϹݱâºÎÅÍ ÀÌ
°øÀå¿¡¼ ÃÖ÷´ÜÀÇ 300mm ¿þÀÌÆÛ ±â¼úÀ» ÀÌ¿ëÇÑ Á¦Ç° »ý»êÀ» °³½ÃÇÑ´Ù°í
¹àÇû´Ù.
silicon wafer : ½Ç¸®ÄÜ¿þÀÌÆÛ
wafer : ¿þÀÌÆÛ
°áÇÔ Á¦¾î ¿þÀÌÆÛ high performance wafer
½Ç¸®ÄÜ ¿þÀÌÆÛ silicon wafer
¿¡ÇÇÅÃ¼È ¿þÀÌÆÛ epitaxial wafer
¿þÀÌÆÛ wafer
silicon wafer : ½Ç¸®ÄÜ ¿þÀÌÆÛ
wafer : ¿þÀÌÆÛ
¿þÀÌÆÛ ½ºÇÇÄ¿(wafer speaker)
¹ÝµµÃ¼ ¿þÀÌÆÛÀÇ ½ºÆ®·¹½º ÃøÁ¤À» À§ÇÑ ¿ÂµµÁ¦¾î¿Í Ç¥¸é °Ë»ç½Ã½ºÅÛ ±¸Çö
Implementation of thermal control and surface inspection system for semiconductor wafer stress measurement
(100)½Ç¸®ÄÜ ±âÆÇÀÇ °áÁ¤¹æÇâ¿¡ µû¸¥ ´Ù°øÁú ½Ç¸®ÄÜ Çü¼ºÀÇ À̹漺¿¡ °üÇÑ ¿¬±¸
Anisotropic Property of Porous Silicon Formation Dependent on Crystal
Direction of (100) Silicon Substrates
-
´Ù°øÁú ½Ç¸®ÄÜÀ» Çü¼ºÇϴµ¥ ÀÖ¾î¼ À̹漺 ¾ç±Ø ¹ÝÀÀ °úÁ¤À» °üÂûÇÏ¿´´Ù.
We have observed anisotropic anodisation process for porous silicon formation.
½ÇÇèÀç·á´Â nÇü ±âÆÇÀ§¿¡ n+°¡ È®»êµÇ°í ±× À§¿¡ n ¿¡ÇÇÃþÀÌ ÀÖ´Â
n/n+/n ±¸Á¶ÀÇ (100) ½Ç¸®ÄÜ ¿þÀÌÆÛ¿´´Ù.
The starting material was (100) silicon n/n+/n wafer structured by
n+ -diffusion on n-type substrate and by subsequent n-epitaxial growth.
»óÃþºÎ n ½Ç¸®ÄÜ ¿¡ÇÇÃþÀ» ½Ä°¢ÇÏ¿© ´Ù°øÁú ½Ç¸®ÄÜ ÃþÀÇ ¾ç±Ø ¹ÝÀÀ âÀ» ³»°í
¾ç±Ø¹ÝÀÀÀÌ n+¸Å¸ôÃþ±îÁö¸¸ ÀϾ°Ô ÇÑ´Ù.
After the top n-silicon epitaxial layer was etched to open the porous
silicon layer(PSL) anodisation window, anodisation takes place only
to n+ -buried layer.
´Ù°øÁú ½Ç¸®ÄÜ ÃþÀÇ Çü¼º°úÁ¤Àº À̹漺À̾ú´Ù.
The process of porous silicon formation on (100) sample was anisotropic,
¹ÝÀÀâÀÇ ÇüŵéÀÌ ¼·Î ´Ù¸¦Áö¶óµµ ¹ÝÀÀµÈ ´Ù°øÁú ½Ç¸®ÄÜ ¿µ¿ªÀÇ
¸ð¾çÀº ¸ðµÎ »ç°¢Çü ÇüÅÂÀÇ °ÍÀ̾ú´Ù.
which was evident from that the shapes of the reacted porous silicon layer
was all squarelike regardless of the shapes of reaction windows.
ÀÌ ½ÇÇè °á°ú´Â ´Ù°øÁú ½Ç¸®ÄÜ ¾ç±Ø¹ÝÀÀÀº ÈÇйÝÀÀ¿¡ ´Þ·Á ÀÖ´Â °ÍÀÌ ¾Æ´Ï°í
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The experimental results show that the PSL anodisation process
does not depend on chemical reaction but does on electrical conduction property,
which is hole mobility depending on the crystal direction.
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